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Previously published as Hybrid Circuits
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Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details.
The journal comprises a multi-disciplinary study of the various technologies, processes and current practices associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages.
Microelectronics International represents a comprehensive and authoritative information source for research, application and current awareness purposes for researchers, senior technical staff and practising engineers within industry and researchers and academics within universities.
Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are:
Microelectronics International is indexed and abstracted in leading service providers, including:
Microelectronics International is available as part of an online subscription to the Emerald Engineering eJournals Collection. For more information, please email email@example.com or visit the Emerald Engineering eJournals Collection page.
* 2015 Journal Citation Reports® (Thomson Reuters, 2016)