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Introduction 

2023 24th International Conference on Electronic Packaging Technology (ICEPT) will be held in Xinjiang, China, from August 8 to 11, 2023. The conference has been hosted by the Institute of Microelectronics, Chinese Academy of Sciences, IEEE-EPS and CIE-EMPT, organized by Shihezi University of and co-organized by The National Center for Advanced Packaging (NCAP China) and Beijing HRZX Consulting Co. It has been recognized as one of the four major brand conferences in the field of electronic packaging.

At present, Moore's Law has reached an inflection point, semiconductor manufacturing technology is facing challenges, and new packaging technologies are constantly emerging. The conference will provide an academic communication platform for experts, scholars and researchers worldwide on new progress and new ideas of electronic packaging and manufacturing technology. The aim of this special issue is to collect the latest advances and developments in electronic packaging presented at ICEPT 2023.

 

List of topic areas

• Advanced Packaging
• Packaging Materials & Processes
• Packaging Design & Modeling
• Interconnection Technologies
• Advanced Manufacturing
• Power Electronics & The new energy and new power system
• Optoelectronics and New Display
• MEMS, Sensors and IoT
• Emerging Technologies & Applications of Electronic Technology for Artificial Intelligence

 

Guest Editors

Dr. Shuye Zhang,
Harbin Institute of Technology, China
[email protected]

Dr. Qidong Wang,
Institute of microelectronics, China
[email protected]

Prof. Mingliang Huang,
Dalian University of Technology, China
[email protected]

Prof. Kyung-Wook Paik,
KAIST, South Korea
[email protected]

 

Submissions Information

Submissions are made using ScholarOne Manuscripts. Registration and access are available by clicking the button below.

Submit your paper here!

Author guidelines must be strictly followed.

Authors should select (from the drop-down menu) the special issue title at the appropriate step in the submission process, i.e. in response to “Please select the issue you are submitting to”. 

Submitted articles must not have been previously published, nor should they be under consideration for publication anywhere else, while under review for this journal.

 

Key Deadlines

Opening date for manuscripts submissions: 15 August 2023
Closing date for manuscripts submission: 1 December 2023    
Closing date for abstract submission: 1 November 2023    
Email for submissions: [email protected]